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Charles Sweet

Smith and Nephew

Life Unlimited

Charles Sweet
Charles Sweet

Company Description

TBD

Consulting Services

Hardware and Systems Engineering, Electronics Design

Primary Market Segments / Industries

Medical Devices, Medical Device Hardware, Medical Device Safety IEC-60601, Industrial Products

Specific Engineering  Fields and Skills

Hardware Engineering, Electronics Design, Embedded Systems, Analog Design, Digital Design, PCB Design and Layout, Mixed Signal Design, Wireless Networks (WiFi Bluetooth)

Additional Engineering  Fields and Skills (Text)

Electronics Design, Hardware Engineering, High Frequency Mixed-Signal Signal Integrity, PCBA Design and Layout, Systems Engineering

Website

Email

Address

Newton, MA, USA

Phone Number

(617)413-6603

Resume/CV Text

Charles M. Sweet +1 617 413 6603 sweet@alum.mit.edu Highly experienced electrical engineer with broad experience in all aspects of system and product engineering from concept to design, development, regulatory compliance, manufacturing and post-launch support. Expertise Precision instrumentation, low-level, analog signal acquisition and conditioning, low-noise analog-to-digital conversion, digital signal processing, multi-Gbps data transmission (vision and datacom) and multi-physiological sensors systems’ integration. Proficient with almost all software engineering tools for circuits’ simulation, timing analysis, electro-magnetic modeling, schematic capture, and PCB layout as well as all pertinent ISO and IEC standards. Experience More than 20 years of continuingly increased engineering achievements with various advanced technologies companies like Smith and Nephew, Bose, Cambridge Consultants, Sunrise Labs, and Teradyne. Education Massachusetts Institute of Technology, MS in Mechanical Engineering Boston University, MS in Electrical Engineering Affiliations IEEE Boston Consultants Network – secretary Medical Development Group (MDG) – member Employment History Smith and Nephew Sr. Staff Electrical Engineer 2022 – 2025 Staff Electrical Engineer 2017 – 2022 Bose Corporation Electrical Engineer III 2016 – 2017 Cambridge Consultants Principal Hardware Engineer 2015 – 2016 Sunrise Labs Principal Engineer 2009 – 2015 Teradyne Test Division Lead Hardware Engineer 2004 – 2008 Sr. Hardware Design Engineer 1995 – 2008 Patents - 2 issued and 2 pending US Patent US6784679B2, “Differential Coaxial Contact Array for High Density High Speed Signals” US Patent US7143323B2, “High Speed Capture and Averaging of Serial Data by Asynchronous Periodic Sampling” US Patent US20240315542A1, “Smart Light Isolator” (pending) US Patent US20230172424A1, “Method and system of inferring state of an inductive powered load” (pending) Papers Sweet, Foley, and Verheul, “Signal Delivery Interface Challenges” Sweet and Bandla, “Gazelle High Speed Differential Digital Subsystem” Andersen and Sweet, “A Prototype Loran Augmented GPS”

Resume/CV Document

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