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Charles Sweet
Smith and Nephew
Life Unlimited

Company Description
TBD
Consulting Services
Hardware and Systems Engineering, Electronics Design
Primary Market Segments / Industries
Medical Devices, Medical Device Hardware, Medical Device Safety IEC-60601, Industrial Products
Specific Engineering Fields and Skills
Hardware Engineering, Electronics Design, Embedded Systems, Analog Design, Digital Design, PCB Design and Layout, Mixed Signal Design, Wireless Networks (WiFi Bluetooth)
Additional Engineering Fields and Skills (Text)
Electronics Design, Hardware Engineering, High Frequency Mixed-Signal Signal Integrity, PCBA Design and Layout, Systems Engineering
Website
Address
Newton, MA, USA
Phone Number
(617)413-6603
Resume/CV Text
Charles M. Sweet
+1 617 413 6603
sweet@alum.mit.edu
Highly experienced electrical engineer with broad experience in all aspects of system and product engineering from concept to design, development, regulatory compliance, manufacturing and post-launch support.
Expertise
Precision instrumentation, low-level, analog signal acquisition and conditioning, low-noise analog-to-digital conversion, digital signal processing, multi-Gbps data transmission (vision and datacom) and multi-physiological sensors systems’ integration.
Proficient with almost all software engineering tools for circuits’ simulation, timing analysis, electro-magnetic modeling, schematic capture, and PCB layout as well as all pertinent ISO and IEC standards.
Experience
More than 20 years of continuingly increased engineering achievements with various advanced technologies companies like Smith and Nephew, Bose, Cambridge Consultants, Sunrise Labs, and Teradyne.
Education
Massachusetts Institute of Technology, MS in Mechanical Engineering
Boston University, MS in Electrical Engineering
Affiliations
IEEE Boston Consultants Network – secretary
Medical Development Group (MDG) – member
Employment History
Smith and Nephew Sr. Staff Electrical Engineer 2022 – 2025
Staff Electrical Engineer 2017 – 2022
Bose Corporation Electrical Engineer III 2016 – 2017
Cambridge Consultants Principal Hardware Engineer 2015 – 2016
Sunrise Labs Principal Engineer 2009 – 2015
Teradyne Test Division Lead Hardware Engineer 2004 – 2008
Sr. Hardware Design Engineer 1995 – 2008
Patents - 2 issued and 2 pending
US Patent US6784679B2, “Differential Coaxial Contact Array for High Density High Speed Signals”
US Patent US7143323B2, “High Speed Capture and Averaging of Serial Data by Asynchronous Periodic Sampling”
US Patent US20240315542A1, “Smart Light Isolator” (pending)
US Patent US20230172424A1, “Method and system of inferring state of an inductive powered load” (pending)
Papers
Sweet, Foley, and Verheul, “Signal Delivery Interface Challenges”
Sweet and Bandla, “Gazelle High Speed Differential Digital Subsystem”
Andersen and Sweet, “A Prototype Loran Augmented GPS”
Resume/CV Document
Company Brochure
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